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Technology Stocks : Aeroflex (ARX)
ARX 13.58-1.6%3:59 PM EST

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To: Todd DeMelle who wrote (196)8/18/1997 12:02:00 PM
From: Jeffery E. Forrest   of 586
 
... my impression is that this has to do with plastic casing or packaging... does anyone have a better sense of this?

Todd, by "packaging", I believe they are talking about how many circuits (density) can be "packaged" on a single module (MCM).
See:
aeroflex.com
I found the following on the above page:
Aeroflex also offers improved higher density memory module packaging solutions where DESC SMD parts are not adequate.

I'm making an educated guess here based on what I read at the ARX website aeroflex.com.
If anyone with a stronger technical background can fill in the blanks, please jump in anytime.
***
Here's something inre the plastic reference (plastic modules as opposed to ceramic):
aeroflex.com

Hope this helps
JEF
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