Novellus Expands 300-mm Copper Market Share at Leading Dedicated Foundries
Monday April 12, 8:30 am ET
Multiple Orders for SABRE(R) Electrofill(R) and INOVA(R) PVD Systems Received from TSMC and Chartered
SAN JOSE, Calif., April 12 /PRNewswire-FirstCall/ -- Novellus Systems, Inc. (Nasdaq: NVLS - News), the productivity and innovation leader in advanced deposition, surface preparation and chemical mechanical planarization processes for the global semiconductor industry, today announced that Taiwan Semiconductor Manufacturing Corp. and Chartered Semiconductor Manufacturing will take delivery of multiple SABRE copper Electrofill systems and INOVA physical vapor deposition (PVD) systems for copper barrier/seed applications. The surging order momentum in 300-mm systems from these key customers underlines the growing evidence that Novellus' copper metallization systems are widely accepted by the semiconductor industry, especially at 300 mm.
According to Tom St. Dennis, Novellus' executive vice president of sales and customer satisfaction, these volume orders reflect the heightened market demand for Novellus' 300-mm copper technology, which combines industry-leading performance with important cost-of-ownership advantages. "Our customers report that the advanced technology capabilities and productivity of our SABRE and INOVA systems were primary decision drivers for these volume orders. We're very glad that both have chosen to partner with Novellus as they accelerate production schedules to meet ramped-up demand for their most advanced devices."
In addition to other Novellus deposition systems, Chartered's shipments include both SABRE and INOVA tools for copper metallization applications, all of which are headed for the dedicated foundry's 300-mm facility, Fab 7, located at its Singapore Woodlands campus.
TSMC's orders include multiple orders for SABRE systems and INOVA xT systems. The tools are being shipped to the foundry's 300-mm Fab 12 and Fab 14 facilities.
"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995:
The statement regarding TSMC and Chartered taking delivery of multiple SABRE and INOVA systems and tools, as well as other matters discussed in this news release that do not concern purely historical data, are forward-looking statements. The forward-looking statements involve risks and uncertainties, including, but not limited to, the failure of TSMC or Chartered to take delivery of the multiple SABRE and INOVA orders, as well as other risks and uncertainties discussed in our filings with the Securities and Exchange Commission (SEC). Actual results could differ materially. We assume no obligation to update this information. For more details relating to risks and uncertainties that could cause actual results to differ from those anticipated in our forward-looking statements, and risks to our business in general, please refer to our SEC filings, including our Annual Report on Form 10-K for the year ended December 31, 2003.
About Novellus:
Novellus Systems, Inc., an S&P 500 company, manufactures, markets and services advanced deposition, surface preparation and chemical mechanical planarization equipment for today's advanced integrated circuits. Our products are designed for high-volume production of advanced, leading-edge semiconductor devices at the lowest possible cost. Headquartered in San Jose, Calif., with subsidiaries throughout the United States, as well as in the United Kingdom, France, Germany, the Netherlands, Ireland, Italy, Israel, India, China, Japan, Korea, Malaysia, Singapore and Taiwan, we are a publicly traded company on the Nasdaq stock exchange and a component of the Nasdaq-100 Index®. Additional information about Novellus is available on our home page at www.novellus.com.
NOTE: Electrofill, INOVA and SABRE are registered trademarks of Novellus Systems, Inc.
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Source: Novellus Systems, Inc. |
