Novellus acquires Angstron in ALD equipment play
By Mark LaPedus
Silicon Strategies
04/12/2004, 9:15 AM ET
SAN JOSE, Calif.--Novellus Systems Inc. Monday (April 12) took a step in the atomic layer deposition (ALD) equipment market, by acquiring startup Angstron Systems Inc. for an undisclosed price.
The move enables Novellus to offer an ALD tool for copper interconnect applications. Applied, Genus, and a number of startups also offer ALD equipment for similar applications.
Angstron--a Santa Clara, Calif.-based startup founded by former members of Applied Materials Inc.--has been developing a new 200-mm version of its ALD equipment line for copper/barrier seed applications. Angston's new system is a more compact and less expensive version of its current 200/300-mm bridge tool (see November 3, 2003 story).
Under the plan with Novellus, Angstron's ion-induced ALD technology will be integrated on Novellus' Inova xT platform. The move is intended to strengthen Novellus' copper barrier/seed product portfolio, according to the San Jose-based chip equipment provider.
Angstron's employs a ion-induced ALD technique that results in a high density, ultra-thin conductive barrier film, enabling the industry to keep pace with the roadmap for copper line resistance. Angstron's technology is less sensitive to materials deposited in prior manufacturing process steps, thereby increasing the reliability of the device.
"Angstron's ALD technology will help us provide an innovative solution to our customers' most challenging copper interconnect integration problems," said Joe Laia, vice president of Novellus' PVD Business Group, in a statement. "Customer interest is high, with shipments anticipated by the fourth quarter of this year." |
