EP, "I did no such thing."
No, you mislead, and severely. You made an assertion that
the problem mist be minor, and in definite terms:
you said "this is", not "likely is", or something
like that. The essence of your assessment is technically
absolutely wrong: if you are an "expert" as you say,
you should know that the passivation layer is a thin
layer of SiO2, or simply a layer of GLASS. If you don't
clear contact pads, nothing could make an electrical
contact, and the packaged chip would immediately fail,
will be dead out the water, and never would get out the
factory in first place. Even a solder ball process would
never proceed, you, expert.
Not having guts to admit such blunder and responding
in the way you did, the only escape route for you
from this situation is to say that you simply made a
joke, as you did before several times. I will understand.
- Ali |
