DocoMo UMTS Chipsets from Renesas & TI
>> TI, DoCoMo Extend 3G Handset Chip Development Program
John Walko
London
CommsDesign.com
Jul 13, 2004
commsdesign.com
Texas Instruments Inc. and NTT DoCoMo have extended their development agreement to include joint work on a multimode W-CDMA/GSM/GPRS chip set that integrates a digital baseband and an applications processor based on TI's OMAP2 architecture.
The deal also includes development and testing of power management, RF and protocol software that TI will also be able to sell to other OEMs as a system solution.
The agreement follows an announcement on Monday (July 12) that Renesas Technology has secured a $65 million, three-year development contract from the Japanese mobile operator for a single-chip baseband device to be used in dual-mode handsets operating on W-CDMA and GSM/GPRS networks.
TI did not disclose financial details, but said both sides would contribute intellectual property. It stressed it would not be restricted in future uses of the product.
DoCoMo already uses the earlier version of the OMAP applications processors in phones using its FOMA third-generation network. The chip set based on the OMAP2 architecture will be the first to be integrated with a digital baseband and to be manufactured using a 90-nm process technology, according to TI.
Phones incorporating the device are expected to be available in the first half of 2006.
>> New UMTS Products to be Based on TI's OMAP 2 Architecture and NTT DoCoMo's W-CDMA Technology
Tokyo
July 13, 2004
focus.ti.com
Texas Instruments Incorporated (TI) (NYSE:TXN) and NTT DoCoMo, Inc., announced today a joint agreement to develop a cost-competitive, multi-mode UMTS (W-CDMA/ GSM/GPRS) chipset to serve the Japanese, U.S. and worldwide 3G handset market. This collaboration further strengthens a long-standing relationship between the two industry leaders to drive the faster market adoption of 3G handsets. An integrated UMTS digital baseband and applications processor will be developed based on TI's OMAP 2 architecture and NTT DoCoMo's W-CDMA technology for NTT DoCoMo handsets and other 3G handsets worldwide. Additionally, the agreement will include development and testing of power management, RF and protocol software that will be made available as system solutions to TI's worldwide customer base.
Japan's premier mobile communications company, NTT DoCoMo is a leader in 3G services with more than 4 million subscribers in the rapidly growing Japanese market. NTT DoCoMo has had a close relationship with TI and uses TI's OMAP family of applications processors in its FOMA phones. In addition, TI's RF and power management products are utilized in some NTT DoCoMo FOMA phones on the market today.
To be manufactured using TI's 90nm technology, this new UMTS solution will be the first to integrate TI's OMAP 2 applications processor with a digital baseband. TI's OMAP 2 "All-in-One" architecture provides the foundation for mobile device manufacturers to merge today's most compelling high-end consumer electronics in smartphones and other converged portable multimedia devices. OMAP 2 processors will re-define mobile entertainment and communications as the first solutions to deliver consumer electronics-quality user experiences to the wireless industry, such as digital TV, hi-fi music with 3D effects, up to DVD-quality video, high-end gaming console functionality, best-in-class color display, and digital cameras with up to 6 megapixels.
Expanding upon TI's existing UMTS chipset portfolio, TI will also develop a series of UMTS chipsets for the general market based on this solution with a roadmap encompassing multi-mode EDGE and higher data rate HSDPA offerings. The complete system solution will include the integrated digital baseband and OMAP 2 applications processor, as well as RF and power management devices.
"TI looks forward to continuing to support NTT DoCoMo as it works to bring advanced multimedia services to consumers. By joining forces, TI and NTT DoCoMo create a winning solution for the UMTS market," said Gilles Delfassy, TI senior vice president, wireless terminals business unit. <<
>> Renesas, DoCoMo to Jointly Develop 2.5/3G Apps Processor
By John Walko
London
CommsDesign
12 July 2004
eetuk.com
Renesas Technology has secured a $65 million, three-year development contract from Japanese mobile operator NTT DoCoMo for a single-chip baseband device to be used in dual-mode handsets operating on W-CDMA and GSM/GPRS capable networks.
The partners will combine W-CDMA technology developed by NTT DoCoMo with Renesas Technology's SH-X based multimedia application processor core, dubbed the SH-Mobile 4A.
The deal is the first of its type for Renesas, according to Matthew Trowbridge, the company's European CEO. "DoCoMo has already used this business model very successfully to speed the development of handsets and the uptake of new services, and we are delighted they have chosen our applications processor as the basis of single-chip, dual-mode parts for third generation handsets," Trowbridge told CommsDesign.com.
Samples of the device are expected to be available by early 2006.
Renesas will supply chips to handset makers who can use DoCoMo's networks based on both W-CDMA 3G specifications as well as GSM/GPRS. The operator will receive a license fee for each handset sold for the upfront development investment.
The contract is nonexclusive, and Trowbridge said Renesas is already "discussing similar deals with other operators worldwide. Several operators are now keen to follow DoCoMo's example."
He said the deal is a major boost to the SH-Mobile architecture "that is already used in about 50 percent of the mobile handsets that use an applications processor."
The core to be used in the DoCoMo project is a version of the SH-X two-way superscalar device that is already in development capable of 4,500 Mips/W. Versions are already used in car information systems. <<
>> Renesas Technology and NTT DoCoMo to Jointly Develop Single-Chip LSI for W-CDMA/GSM/GPRS Mobile Handsets
TOKYO
Business Wire
July 12, 2004
tmcnet.com
Baseband LSI and SH-Mobile Application Processor on a Single Chip
Renesas Technology Corp. today announced an agreement with NTT DoCoMo, Inc. to jointly develop a single-chip LSI for dual-mode handsets for third-generation W-CDMA and second-generation GSM/GPRS, with the aim of promoting the global use of FOMA services.
The two companies will combine W-CDMA technology developed by NTT DoCoMo with Renesas Technology's LSI fabrication, multimedia application processor, and GSM/GPRS technologies, to achieve single-chip implementation of a baseband LSI and SH-Mobile application processor for dual-mode handsets.
Major features of the new LSI are as follows:
1. Support for W-CDMA+GSM/GPRS dual-mode handsets
2. Baseband LSI and SH-Mobile application processor on a single chip
3. Use of SH-Mobile third-generation CPU core (development project name: SH-X) offering powerful multimedia application processing, including image, audio, and Java capabilities, together with low power consumption
The two companies plan to have a product ready in the first half of fiscal 2006. Renesas Technology will collaborate with NTT DoCoMo to offer handset manufacturers a platform based on the new LSI and promote worldwide use of FOMA services and reduce costs. Renesas Technology also plans to provide this single-chip LSI for the UMTS market.
About Renesas Technology Corp.
Renesas Technology Corp. designs and manufactures highly integrated semiconductor system solutions for mobile, automotive and PC/AV markets. Established on April 1, 2003 as a joint venture between Hitachi, Ltd. (NYSE:HIT) and Mitsubishi Electric Corporation and headquartered in Tokyo, Japan, Renesas Technology is one of the largest semiconductor companies in the world and world leading microcontroller supplier globally. Besides microcontrollers, Renesas Technology offers system-on-chip devices, Smart Card ICs, mixed-signal products, flash memories, SRAMs and more. renesas.com <<
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