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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 213.43+6.2%Dec 19 9:30 AM EST
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To: THE WATSONYOUTH who wrote (133396)9/21/2004 4:29:55 PM
From: Joe NYCRead Replies (1) of 275872
 
TWY,

Can your translate this for us to English:

Under this letter agreement, the Company's licenses under the C-4 Agreements are extended to allow the Company to (i) bump 300-millimeter wafers for the Company in its 300-millimeter Dresden fabrication facility; (ii) manufacture AMD branded products in its 300-millimeter Dresden fabrication facility using the C-4 bump technology; (iii) sell AMD-branded products made in its 300-millimeter Dresden fabrication facility using the bump technology; and
(iv) have another manufacturer make an apparatus for bumping 300-millimeter wafers. Pursuant to the letter agreement, the Company also obtained a license to bump a substantial number of 200-millimeter wafers for third parties at no charge, and to bump any additional 200-millimeter wafers for a royalty payment based on the bumping fees the Company charges to the third parties.

What does the word bump mean in this context.

Joe
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