SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 203.14-0.8%Jan 9 9:30 AM EST

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: TGPTNDR who wrote (133644)9/23/2004 8:37:28 PM
From: dougSF30Read Replies (1) of 275872
 
Actually, since then, Paul@iHub made his brilliant observation, and I think we can't assume there is any problem.

In fact, I think the evidence suggests 90nm is disspating less power than 130nm, at least at the 3500+ bin.

It's not quite clear where they placed the temperature sensor, but the range of temps under load suggests "die-like" temperatures, not "avg. heatsink" temperatures.

The photo lends some support to this notion-- the sensor cable is the one with two black wires.

The point is that one would expect the die temperature of an 84mm^2 part dissipating the same power as a 144mm^2 part to be considerably higher.

Therefore, the fact that the 90nm "die-like" temperature is only up a little bit, *and* that is with the 90nm part being overvolted by 5%, suggests that the 90nm part is dissipating LESS power than the 130nm Newcastle.

Doug
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext