SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 215.00+0.7%Dec 22 3:59 PM EST
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: dougSF30 who wrote (133636)9/23/2004 11:20:01 PM
From: eCoRead Replies (2) of 275872
 
Doug,

I think that equation is a vast oversimplification. The heat is being driven through several different materials of different shapes and conductances. You really need a finite element analysis.

There are so many variables for obtaining those results, we really shouldn't sweat it too much:

1) Probe location relative to the heat source
2) Variability in the quality of probe's connection
3) Voltage variability
4) Variability of thermal grease application
5) Ambient temperature changes
6) Fan speed variability (was it self-regulating?)
7) And finally, maybe the die actually was producing more heat. :)

A power measurement would have been nice. We'll know before long.

eCo
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  

HomeMailHotSubjectMarksPeopleMarksKeepersSettings
Terms Of UseContact UsCopyright/IP PolicyPrivacy PolicyAbout UsFAQAdvertise on SI
© 2025 Knight Sac Media.  Data provided by Twelve Data, Alpha Vantage, and CityFALCON News