Amkor, PSi Sign Patent License Agreement
Online Staff -- Electronic News, 12/13/2004
Amkor Technology Inc. and PSi Technologies Holdings, Inc. have signed a broad, multi-year patent license agreement allowing PSi to utilize MicroLeadFrame patents and granting Amkor access to PSi's PowerQFN technology.
MicroLeadFrame (MLF) is Amkor's proprietary version of the QFN or quad, flat-pack, no lead package. Amkor's MLF package is a lead frame-based, nearly chip-scale package with an exposed die paddle and leads on the bottom of the package, according to Amkor. It rolled out the technology in the late 1990s, and has shipped more than 2 billion MLF packages.
PSi's PowerQFN-type package utilizes heavy aluminum wire, solder die attach, clip leads and an encapsulated molded array package singulation approach, geared specifically for the higher voltage and thermal requirements of the power semiconductor market, according to the company. PSi anticipates beginning production on its PowerQFN family of packages during the first quarter of 2005 |
