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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 249.66+7.6%3:59 PM EST

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To: Joe NYC who wrote (147512)1/11/2005 10:29:06 PM
From: burn2learnRead Replies (1) of 275872
 
sorry I meant to write

AMD 90nm process on 200mm
IBM 90nm process on 300mm

someone here or on Ihub wrote that they thought that AMD would ramp fab36 on 90nm. I think this can't be done, and the the 65nm process is not ready in time for fab quals (fab is ready first).

200mmm amd 90 process. Many changes to understand to transfer to 300mm. PLasma chambers act different for example, you just cant scale process recipe times...just like a plane designer would fail trying to build a big plan out of a smaller plane design and just scaling the project.

300 IBM process 90nm - two many differences from 65 nm process. Design spec changes, strained silicon, maybe no SOI, Nickel Salicide, low k implementation (just because low k is advertised does not mean its used the same on each process), bump process changes, barrier seed changes, etch stop layer changes, ild thickness, process flow to create strained / salicide, number of metal lines -> pitch changes...on and on.

The fab is stuck between two process nodes. One would be able to transfer but not worth the ROI and the other too far out. I think it will sit idle for sometime, or tool qual will be milked.
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