Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 231.83

+1.7%

Jan 16 9:30 AM EST

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To: Elmer Phud who wrote (148651)	1/21/2005 1:58:57 PM
From: burn2learn	Read Replies (2) of 275872

Elmer just a few items to screw with you numbers. I'm thinking along what Doug has been posting recently. Assume these variables Btq high bin P4 parts suffer 30-40% Le loss. these are the die left over after defetcts considered and are testable. So a high bin P4 part = 256 DPW from your numbers 4280.6=256 GDO or ~$9.3. of these parts only some fraction make top bin (maybe 10-20% when times are good). Smithfield, if it is two die connected then since not BTQ they have LE (litho expose) loss ~1-2% of testable die. 428098 =419GPW at sort the real question is how do you connect the die. Can you match separate die on the wafer in such case (419/2)/2400 =$11.4 of course some die wont match and would be should as 3.0 gig parts. but if die have to be next to each other on the wafer you still get $11.4 but a mix of single core and dual core parts because not all die have functional die next them. On top of that I'm sure the die would have to be matched at some performance level to be a DC product. I think Intel has a better chance of getting more DC parts than top bin SC parts thus cost less to consumer. fatter sweet spot

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