Perhaps, the back end is looking up...
Taiwan DRAM back-end firms ramping DDR2 packaging capacity
Amy Lee, Taipei; Jack Lu, DigiTimes.com [Wednesday 2 February 2005]
DRAM back-end firms in Taiwan are ramping their DDR2 packaging capacity to a level where they can handle the accelerating conversion from DDR to DDR2, according to sources.
The available DDR2 packaging technologies in Taiwan include Window ball-grid array (BGA), Micro BGA and Mini BGA.
The sources pointed out that Window BGA is currently the mainstream technology; it is used by Samsung Electronics, Hynix Semiconductor, ProMOS Technologies and Powerchip Semiconductor Corporation (PSC). Elpida Memory uses micro BGA.
Powertech Technology plans to ramp its Micro BGA capacity to 54 million units per month by the end of February, up from 27 million units in December, 2004. Over the same period, the firm’s Window BGA capacity will triple to three million units, according to sources. By the end of 2005, Powertech will have a combined capacity for packaging up to 11 million DDR2 chips per month, the sources added.
According to sources, ChipMOS Technology currently has the capacity to package five million chips per month, including Micro BGA and Mini BGA units. The United Test Center (UTC) uses Window BGA, with a capacity currently reaching 1.5 million units per month. |
