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Technology Stocks : Kulicke and Soffa
KLIC 39.93+0.9%Oct 31 9:30 AM EST

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To: Cary Salsberg who wrote (5402)2/2/2005 3:54:44 PM
From: Ian@SI   of 5482
 
I don't know the answer but would suspect that contributing factors could be shrinks done for DDR2, or, more dense packing of larger number of contacts requiring bonding.

These are WAGs without any knowledge or research. As such, probably not worth the effort you spent reading the post. <g>

Ian
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