Genus Secures Follow-on Orders from FLASH and DRAM Manufacturer for Multiple LYNX3 300 mm CVD Systems
Friday March 11, 2:30 am ET
SUNNYVALE, Calif., March 11 /PRNewswire-FirstCall/ -- Genus, Inc., a leader in advanced thin film deposition equipment used to manufacture advanced semiconductor and data storage devices, announced today that it has received follow-on letters of intent (LOIs) for multiple LYNX3 300 mm chemical vapor deposition (CVD) systems from a DRAM and FLASH memory device manufacturer. This news follows an earlier announcement today that Genus shareholders have approved the merger with AIXTRON AG, a leading provider of equipment for compound semiconductor epitaxy.
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The new LYNX3 systems will increase the production capacity of current manufacturing and join a number of similar LYNX3 systems already installed and in production at the customer's DRAM and FLASH memory manufacturing facilities. The tools are scheduled to ship by the end of Q2 this year.
"These follow-on orders for additional LYNX3 systems clearly demonstrate Genus' leadership in providing production-proven solutions for semiconductor device manufacturing, and support this customer's leadership position in the FLASH and DRAM memory device segment," said Bill Elder, CEO of Genus, Inc. "Along with our established line of 300 mm atomic layer deposition (ALD) systems, this multiple LYNX3 order is the latest in a series of successful wins for Genus."
"Genus has a long and successful history with this leading FLASH and DRAM memory manufacturer," continued Dr. Elder. "This order further validates our success in providing the production-proven thin film deposition technology that the industry requires in order to meet their aggressive production goals."
About Genus Thin Film Deposition Systems
The Genus LYNX3 system provides production-proven CVD capabilities for manufacturing advanced semiconductor devices on 300 mm wafers. Similarly, the Genus StrataGem300 system provides production-proven ALD capabilities for manufacturing advanced semiconductor devices on 300 mm wafers. |
