To all, is this competition for Flowfill?:
BW0398 SEP 04,1997 17:21 PACIFIC 20:21 EASTERN
( BW)(ALLIEDSIGNAL)(ALD) New Inorganic Polymer from AlliedSignal Makes Spin-On Deposition Process Method of Choice for 0.25 and 0.18-Micron Chip Manufacturing; Superior Planarization Decreases Number of Layers Requiring CMP and Combines with Non-etchback Gapfill to Reduce Cost-of-Ownership
Business Editors and Computer Writers
LOS GATOS, Calif.--(BUSINESS WIRE)--Sept. 4, 1997--A new inorganic (carbon-free) spin-on polymer that is expected to make spin-on deposition the process technology of choice for next-generation 0.25 and 0.18-micron semiconductor manufacturing was announced here today by Geoff Wild, president of AlliedSignal Electronic Materials.
According to Wild, the new product reduces cost-of-ownership (COO) significantly by decreasing the number of layers that require chemical mechanical planarization (CMP), and by allowing a non-etchback gapfill process.
As chipmakers migrate to smaller features sizes, spin-on-polymer
materials for intermetal dielectric insulation applications will likely become the technology of choice. Not only is gapfill accomplished more readily with spin-on deposition when compared to CVD, but also spin-on dielectrics provide opportunities to extend beyond 0.35-micron since the most promising low k candidates for use
at sub-0.35 micron are deposited by the spin-on process.
This, combined with superior planarization, enables a lower COO
solution for the challenges faced at the sub-0.35-micron level.
AlliedSignal's newest solution, called the ACCUSPIN(R) T-22, is an
inorganic spin-on polymer film. It provides a non-etchback process
that addresses these issues, achieving gapfill results to 0.05-micron
-- superior to results demonstrated for CVD dielectric deposition
processes.
"Shrinking geometries will cause chipmakers to choose between a
high-density plasma-deposited oxide or a spin-on solution," noted
Nicole Rutherford, product development manager for AlliedSignal's
Advanced Microelectronics Materials (AMM) business unit, which is
based in Sunnyvale, Calif., and is responsible for manufacturing the
new product. "The migration to a spin-on solution makes more sense
since it's a well-established process that is used in manufacturing
plants worldwide and, more importantly, eliminates the possibility of
plasma damage."
T-22 also offers chip manufacturers significant COO advantages by
providing superior planarization to competing solutions. This equates to a reduction in the number of layers requiring CMP and major cost savings for IC companies. Because of the success of the T-22, AMM is expected to enter partnership agreements soon with several leading IC manufacturers and equipment suppliers to develop greater process integration.
Advanced Microelectronic Materials is a business unit of AlliedSignal Electronic Materials. Electronic Materials provides materials and solutions to the global semiconductor and electronics industries and employs approximately 3,000 people worldwide.
AlliedSignal is an advanced technology and manufacturing company serving customers worldwide with aerospace and automotive products, chemicals, fibers, plastics and advanced materials. With corporate headquarters in Morristown, N.J., AlliedSignal employs more than 77,000 people in 40 countries. It is among the largest 100 companies on the Fortune 500 list and one of the 30 companies included in the Dow Jones Industrial Average (NYSE:ALD).
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CONTACT: AlliedSignal Electronic Materials
Karen Hopkins, 408/341-3055
karen.hopkins@alliedsignal.com
or
Mathews & Clark
Stewart Chalmers, 408/736-1120
chalmers@mathewsandclark.com |
