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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 216.95+0.8%10:17 AM EST

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To: Joe NYC who wrote (156885)4/19/2005 11:59:27 AM
From: Elmer PhudRead Replies (2) of 275872
 
Joe

The die is not the same size as a single core. The build kit is not the same so the package can not be the same even if the ballout is. That's additional qual effort. The highspeed signals are extremely sensitive to packaging so there's more work there to be sure they didn't screw up HT. I'm not saying they couldn't do it, just that it's probably not worth the effort. Smithfield on the other hand has none of these limitations. Any functional die looks just like a stand alone P4 because it is. This is conjecture on my part but it makes sense to me.
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