Semi Equipment Analysis Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Semi Equipment Analysis

SOXX 283.58

+0.3%

Nov 25 4:00 PM EST

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: sixty2nds who wrote (23112)	5/2/2005 8:11:55 AM
From: sixty2nds	Read Replies (1) of 95471

I do not agree with the "nibble" comment which is included in the following KLIC article. I have had better results waiting for a long side entry until a recent high has been taken out. Yes, I miss some of the glory BUT I also miss some of the nicks and cuts of a blade....err...the falling knife. Practice patience, don't be a patient. This is from Briefing.com Updated: 29-Apr-05 10:33 ET Small Cap Profile: Kulicke & Soffa (KLIC) [BRIEFING.COM -- Robert J. Reid] Kulicke & Soffa has exhibited some encouraging, yet still muted, developments pointing to the possibility that the stock is near a cyclical bottom. Last week, Intel raised its cap-ex guidance and KLIC reported a fairly positive MarQ report yesterday. It is difficult to time the bottom of a semi cap equipment cycle, but with a $4-$20 range the past few years it may be time to start nibbling on this one. Background Kulicke & Soffa (KLIC 5.19 +0.04) is a supplier of semiconductor wire bonding assembly equipment. The co believes it is the only major supplier that provides semiconductor wire bonding equipment along with the complementing packaging materials and test interconnect products. Wire bonders are used to connect very fine wires, typically made of gold, aluminum or copper, between the bond pads of a semiconductor die and the leads on the integrated circuit (IC) package to which the die has been attached.

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next