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Technology Stocks : Applied Materials No-Politics Thread (AMAT)
AMAT 230.15-3.2%3:59 PM EST

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To: Bookdon who wrote (15187)6/7/2005 1:27:09 PM
From: etchmeister  Read Replies (2) of 25522
 
"The introduction of new materials and processes at the 65-nm technology node has produced new classes of small defects that directly affect fab yield," said Gilad Almogy, vice president and general manager of Applied's Process Diagnostics and Control Group. "The UVision system has proven its value for critical chip layers, such as shallow trench isolation, contact, poly and gate etch, where chip makers have isolated killer defects not found with traditional brightfield tools."

This sounds like integrated defect detection;
(an etch step is followed by "real time" inspection).
I'm not sure to what degree KLAC has integrated their tools into LRCX and NVLS processing tools
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