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Technology Stocks : Applied Materials No-Politics Thread (AMAT)
AMAT 233.70-1.7%1:57 PM EST

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To: etchmeister who wrote (15203)6/7/2005 4:19:59 PM
From: Kirk ©  Read Replies (2) of 25522
 
"This sounds like integrated defect detection"

Would that allow them to go in and repair defects?

I used to use an RIE to cut metal links in analog test chips I designed where I wanted to tweak the amplifiers to see what worked best before we went to final masks. I used a particle beam etcher to cut metal links to resistors and transistors. With a bit of skill, we could also lay down metal with the beam rather than etch... to make a new connection. I'm not sure how reliable that would be, but for expensive SOCs, this would be a valuable addition to the process. Heck, if most of the defects are particles or unfinished etching, being able to blast a defect out after an inspection would sure help yields. Intel gets quite a bit for each uP so saving even one a wafer could pay for a tool over time.
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