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Technology Stocks : General Lithography
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To: Bob Pack who wrote (558)9/9/1997 9:01:00 PM
From: Yousef   of 1305
 
Bob,

Re: "I'd be very interested in any opinions on DUV photoresist."

So, I will give you my opinions on the current state of DUV resists. There
are a number of problems with these materials (high cost, environmental
sensitivity, need for BARC layers ...).

1) High Cost - Typical DUV resists cost ~$2000/gallon versus ~$750/gallon
for I-line resist. Also BARC's for DUV are even nore expensive !! So
typical DUV layer cost is approximately 2X that for I-Line (as reported
by SEMATECH)

2) Environmnetal Sensitivity - This causes linewidth to change after
exposure - before develop if wafers are allowed to sit for any period
of time. The new resists are much less sensitive to this factor. This
environmental factor has caused the need for resist spin tracks with filtered
enclosures ... and the need for BARC requires that spin tracks support
dual spin cups !!

3) BARC - This is one of the big drawbacks for DUV resists. Of
the resists that I have reviewed (Shipley UV5 & UV6, Olin, JSR & TOK), only
the JSR and TOK resists might be able to get away without a BARC.
Shipley UV5 & UV6 along with the Olin (CAMP series) require BARC's to
give any type of decent result. Not only is BARC an expensive chemical, there have also been defect density issues with this coating.
I believe that many of these defect issues are getting resolved, but it
is clear that BARC adds considerable complexity to a DUV process (BTW,
the BARC has to be etched ... can't be developed !!).

This probably raises more questions than it answers.

Yousef
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