PSI-TEC Releases Report on Advanced Materials for Extremely High-Speed Computer Applications
Thursday August 4, 11:54 am ET
WILMINGTON, Del.--(BUSINESS WIRE)--Aug. 4, 2005--PSI-TEC Corporation, a wholly owned subsidiary of PSI-TEC Holdings, Inc. (Pink Sheets:PTHO - News), has released a report regarding its advanced material design strategies and potential applications of its novel technologies. This recent overview explores potential applications for PSI-TEC's developing materials in the future manufacturing of extremely high-speed microprocessor components known as chip-to-chip optical interconnects.
The recent technology report has been made available on a non-proprietary basis in response to industry requests. PSI-TEC scientists believe that the materials described in this overview have strong application prospects for this high-potential emerging market.
In order to keep pace with Moore's Law, the industry guideline which dictates the number of transistors per integrated circuit double every two years, future high-speed computational systems are expected to exchange data among chips using light (photons) instead of electricity (electrons), ultimately eliminating the need for interconnecting wires. The crucial component necessary to facilitate this photonic transmission of information within the microprocessor is the optical interconnect (OIC) and in order to meet the bandwidth requirements for these OICs, new material and material processing techniques are needed. Research outlined in PSI-TEC's released overview suggests that PSI-TEC materials, currently under development and analysis, may exhibit the processability, performance and stability necessary for this highly demanding material application.
For vertical integration into existing manufacturing processes, OIC materials must also exhibit extreme photochemical stability, thermal stability in excess of 300 degrees Celsius and very high electro-optic character. The newly released research from PSI-TEC outlines how PSI-TEC scientists expect to exceed all of these requirements.
"The released report was designed to be accessible and informative to individuals who may not be experts within the field of electro-optic materials, but who are interested in the impact that an expansion in material capabilities would have on the overall development of future telecommunications networks," said Frederick Goetz, CEO of PSI-TEC Corporation. "The results of our research and development are exciting not only within the scientific realm, but also for the real world applications of such technology."
OIC device development is a highly active area of research within many technology-focused companies, including IBM, Agilent Technologies, Corning and Intel. PSI-TEC scientists expect that their advanced engineering techniques may provide necessary materials for vertical integration into these devices. The report is available at PSI-TEC's corporate website, psiteccorp.com.
About PSI-TEC
PSI-TEC Corporation is a developmental stage company that engineers next-generation electro-optic (EO) plastics for future applications vital to modern commerce, homeland security, and medical technology. PSI-TEC's proprietary electro-optic plastics are produced at the molecular level for superior performance, stability and cost-efficiency and are expected to replace more expensive, lower-performance materials used in fiber-optic ground, wireless and satellite communication networks. For more information regarding PSI-TEC's mission, management and technology, visit us at www.psiteccorp.com. |
