Hydrogen storage/Carbon nanotubes/Mainstream Engineering
United States Patent Application 20050238810
Kind Code A1
Scaringe, Robert P. ; et al. October 27, 2005
Nanotube/metal substrate composites and methods for producing such composites
Abstract
Carbon nanotubes are grown directly on metal substrates using chemical vapor deposition. Metal substrates are comprised of catalysts which facilitate or promote the growth of carbon nanotubes. The nanotube coated metal substrates have applications including, but not limited to, heat transfer and thermal control, hydrogen storage, fuel cell catalytic reformers, electronics and semiconductors, implantable medical devices or prostheses, and tribological wear and protective coatings.
Inventors: Scaringe, Robert P.; (Rockledge, FL) ; Back, Dwight D.; (Pembroke Pines, FL) ; Meyer, John A.; (Palm Bay, FL) ; Davis, Russell A.; (Melbourne, FL) ; Cole, Gregory S.; (Melbourne, FL)
Correspondence Name and Address: CROWELL & MORING LLP
INTELLECTUAL PROPERTY GROUP
P.O. BOX 14300
WASHINGTON
DC
20044-4300
US
Assignee Name and Adress: Mainstream Engineering Corp.
200 Yellow Place
Rockledge
FL
32955
appft1.uspto.gov
Refs:
1) mainstream-engr.com
2) dodsbir.com
MAINSTREAM ENGINEERING CORP.
200 Yellow Place, Pines Industrial Center
Rockledge, FL 32955
Phone:
PI:
Topic#: (321) 631-3550
Dr. Robert P. Scaringe
MDA 03-040 Selected for Award
Title: Demonstration of a High Thermal Conductivity Air Cooled Heat Sink using Carbon Nanotube Composite
Abstract: This proposal will demonstrate a composite material containing aligned carbon nanotubes with thermal conductivity far in excess of traditional copper or aluminum. A unique process for fabricating the aligned carbon nanotubes (CNT) into to a very highly loaded CNT porous composite will be demonstrated in Phase I. Limited thermal conductivity and convective heat transfer experiments will be performed to demonstrate the improvements. The aligned Carbon Nanotube Composite (CNC) will be fabricated into an air-cooled heat sink and demonstrated. In addition to the potential for a thermal conductivity that approaches graphite (6600 W/mK, compared to 390 W/mK for copper), the CNC heat sink is ideal for direct chemical bonding to solid-state electronic devices, thereby eliminating interfacial thermal resistance. This extremely high thermal conductivity material is ideal as a heat-spreading device, which can ultimately be fabricated into air-cooled heat sinks and chemically bonded directly to GaN components as well as other high energy density electronics. Phase I will demonstrate a high thermal conductivity composite heat sink composed of aligned carbon nanotubes with enhanced thermal conductivity, enhanced convective heat transfer, and improved interface thermal conductance. Phase I will include manufacturing techniques, design specifications, experimental data and cost analysis. This effort will experimentally demonstrate the performance of a thermally conductive material that can be fabricated into air cooled heat sinks and related thermal devices to provide a heat flux capability that far exceeds traditional copper or aluminum materials. The proposed material would be applicable to all types of air-cooled heat sinks. In addition to the MDA applications, other potential applications include commercial or military electronics cooling (high-power electronics, supercomputers, electronic switchgear, and avionics). Mainstream has performed a commercialization study and the commercial potential is tremendous. A commercialization partner has been secured as well as Phase II matching funds.
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