QUALCOMM Ships Second Billion Chips to Meet Surge in Demand
08.11.2005 - 11:44 Uhr, Qualcomm Incorporated [Pressemappe]
London, November 8 (ots/PRNewswire) -
- Outpacing Expectations, Milestone Follows Just Two Years After
First Billion Chips Shipped -
QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and
innovator of Code Division Multiple Access (CDMA) and other advanced
wireless technologies, today announced that the Company has shipped
two billion chips since 1996 when it delivered the first commercial
CDMA solutions to wireless handset and infrastructure customers.
QUALCOMM marked the shipment of the first billion chips in 2003,
marking an exceptional acceleration in the quantity of chips being
delivered to the wireless industry. QUALCOMM's chipsets have been
instrumental in the robust growth of CDMA technology and helped make
the Company the largest provider of third-generation (3G) technology
today.
"To reach such a significant milestone as a second billion chips
shipped in only two years reinforces QUALCOMM's stellar growth and
leadership position in the wireless industry," said Dr. Sanjay K.
Jha, president of QUALCOMM CDMA Technologies. "Our continuing
expansion into new markets and solid commitment to the success of our
industry partners has enabled the rapid deployment and advancement of
wireless technologies around the world. I would like to take this
opportunity to thank all of our customers and partners, and above
all, QUALCOMM employees for helping us reach this important
milestone."
QUALCOMM solutions power a significant number of the more than 740
commercial CDMA2000(R) and WCDMA (UMTS) wireless devices available
today. These devices include 3G multimedia and gaming devices;
still-image camera and video phones; high-accuracy GPS
positioning-enabled phones and dedicated tracking devices;
smartphones and wireless PDAs; and low-cost voice and basic data
phones that allow operators to provide entry-level services,
leveraging the superior network capacity provided by CDMA-based
standards.
QUALCOMM has integrated a greater number of functions into its
solutions, enabling the development of cost-effective devices with
key features that take advantage of the larger bandwidth available on
3G networks. These features -- multimedia, connectivity, storage,
position-location, and user-interface capabilities from the
Launchpad(TM) suite of integrated technologies -- have enabled
support for multi-megapixel cameras, video telephony, streaming
multimedia content, 3D gaming, CD-quality audio playback, DVD-quality
video playback, and comprehensive GPS position-location technology.
QUALCOMM provides the industry with highly integrated,
cost-effective chipsets including baseband modems, radio frequency
integrated circuits (ICs), power management (PM) ICs, and supporting
system software. There are more than 150 CDMA2000 1X, CDMA2000
1xEV-DO and WCDMA operators in 71 countries who currently support
more than 210 million 3G subscribers around the world (source:
3Gtoday.com).
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