jimbob9 - Thanks for a very enlightening post. As a JMAR and CYMI shareholder, I appreciate this explanation.
I currently am on the mailing list for the newletter "One Step Ahead" published by SAL (Suss Advanced Lithography, Inc.). This article was in the most recent issue dated Vol. 2, #5, 1997. It provides ammunition for the future of XRL over DUV:
CHALLENGES OF 193 NM LITHOGRAPHY
With the anticipated extension of 248 DUV technology to 0.18 micron, it is clear that the timeline for insertion of 193 nm lithography for 0.15 micron is aggressive. The technical challenges are understood and solutions are being proposed and tested. There is little doubt that researchers can make 193 work, but will it be worth the time and investment to develop, debug, and integrate into production for only one generation?
The technical challenges are daunting:
* Lens: Radiation damage limits material choices and lifetime, making lenses expensive.
* Stepper: Field size is a major concern--presently 2x2 mm field available.
* Source: Excimer lasers under development; no reliability track record.
* Resists: A new group of commercialized resists are needed.
* Masks: No product masks available; substrate and pellicle material not defined; OPC/PSM extend writing time.
By contrast, x-ray lithography has over 13 years of experience, is extendable down to 0.07 micron and is more cost effective. X-ray systems are available now for production, and major device manufacturers have begun to make their commitments.
Betty |
