Amkor Unveils Flip-Stack Technology
Online Staff -- 1/17/2006
Electronic News
Amkor Technology Inc. today took the wraps off hybrid flip-chip/wirebond stacked packaging technology it has dubbed Flip-Stack.
Amkor's Flip-Stack chip scale package (CSP) combines Amkor's flip chip process with conventional wirebond technology. The result is a cost-effective, high-performance 3D package that supports the transition from wirebonding to flip chip technology, the company claims.
The Flip-Stack package is specifically designed for high-performance DSPs, ASICs and RF chips in consumer apps, including wireless handsets, digital cameras and digital entertainment devices, Amkor said. The company observed that although 3D stacked die packages based on wirebond interconnect have been in production for several years, advancements in wafer fabrication technology are driving the transition to flip chip technology for performance reasons.
The Flip-Stack CSP can stack flash or mobile DRAM memory over high performance logic chips, such as DSPs and ASICs, according to Amkor. In the Flip-Stack CSP configuration, the bottom logic device is attached to the package substrate using flip-chip solder bumps; the top ICs are then attached to the flip-chip die and wirebonded to the package substrate.
The Flip-Stack CSP is lead-free and RoHS compliant, and is offered in a standard fine pitch ball grid array ackage outline, according to Amkor. The use of the flip chip architecture means that Flip-Stack CSP may in some cases be designed into a smaller footprint than traditional wirebond stacked CSP, the company said.
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