TEXAS INSTRUMENTS QUALIFIES 65 NANOMETER CHIP PROCESS AND IS MOVING TO VOLUME MANUFACTURING (usually margins should improve as function of ramp)
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DALLAS (December 6, 2005) - Texas Instruments Incorporated (NYSE: TXN) (TI) announced it has qualified its advanced 65-nm process technology only eight months after delivering first samples of a wireless device and is moving to volume manufacturing. The TI 65-nm process delivers more processing performance for advanced applications in a smaller space without increasing power consumption. TI is leading the volume ramp to production for 65nm process technology with volume product delivery across its targeted markets, including wireless communications.
"TI's model of driving our own in-house process technology development and initial production ramp in one TI fab and then fanning out to multiple fabs and foundries allows us to quickly achieve very high volumes for our customers," said Dr. Hans Stork, chief technology officer, Texas Instruments. "In this business, building some sample parts is good, but the competitive advantage goes to the supplier who can first deliver millions of high quality products."
TI first disclosed details around its advanced 65-nm CMOS process in early 2004, and announced sampling of the wireless digital baseband processor in March 2005. The process technology doubles transistor density over the company's 90nm process, shrinking equivalent designs by half and boosting transistor performance by up to 40 percent. In addition, TI's technology significantly reduces leakage power from idle transistors while simultaneously integrating hundreds of millions of transistors that support both analog and digital functions in System on Chip (SoC) configurations.
"Our relationship with Texas Instruments is based on close technology collaboration", said Tommi Uhari, VP, Wireless Platforms, Nokia. "Early access to such solutions as TI's 65-nm process helps Nokia get to market faster with the most advanced products and capabilities that our customers require." |