TO ALL: ROCKWELL JOINS PAIR ALLIANCE.
Folks: I don't see this news here, so I thought I'd share it. Here ya go!
08:03 Rockwell Joins PairGain And Others In Alliance Developing Single-Pair HDSL Standard
NEWPORT BEACH, Calif.--(BUSINESS WIRE)--Sept. 16, 1997--
Rockwell will collaborate with PairGain and other leading telecom companies; plans to develop silicon solutions for the new standard that will enable full HDSL performance over single-pair copper wiring.
Rockwell Semiconductor Systems Tuesday announced that it has joined an alliance formed by PairGain Technologies and other leading telecommunications companies to collaborate on a new single-pair T1 standard for High-bit-rate Digital Subscriber Line technology, known as HDSL2. PairGain and other founders of the HDSL2 alliance presented a proposal in June to the American National Standards Institute (ANSI) for a unified suite of line codes, modulation and error-correction standards for the emerging single-pair HDSL standard. ------------------------------------------------------------------------------ PRESS (RETURN) FOR MORE, /M FOR HEADLINES, OR ENTER A NEW REQUEST.
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The group's proposal has been named OPTIS (Overlapped PAM Transmission with Interlocking Spectra). In support of the OPTIS proposal, Rockwell plans to expand its already broad offering of HDSL solutions and add a family of HDSL2-compliant chips that provide the same performance and service distance over a single line that HDSL currently provides over two lines. "Rockwell is very excited to be joining this group of organizations supporting and developing the OPTIS HDSL2 standard," said Ron Cates, product line manager at Rockwell's Network Access Division. "We consider HDSL2 to be one of the most important developments in the evolving local loop telecom infrastructure, and will be actively contributing to the group's work." The proposed OPTIS HDSL2 specifications will let service providers deliver full T1 (1.544 Mbps) performance over a single twisted pair cable, with the same reach, robustness and spectral compatibility of today's two-pair HDSL. This will allow local exchange carriers (LECs) and telecom service providers to meet rapidly increasing demands for business and Internet access services in environments where copper pair shortages exist. "We're pleased to have Rockwell join this alliance," said George Zimmerman, chief scientist at PairGain Technologies. ------------------------------------------------------------------------------ PRESS (RETURN) FOR MORE, /M FOR HEADLINES, OR ENTER A NEW REQUEST.
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"Rockwell brings tremendous expertise in silicon solutions for communications systems, and will help us to accelerate the development and deployment of interoperable HDSL2-based solutions." Rockwell was an early pioneer in HDSL technology through its acquisition of Brooktree Corp. in September 1996. The company's first product for this market was a low-cost CMOS analog-to-digital converter introduced in 1992, followed by the industry's first all-digital HDSL transceiver in 1994 and a single-pair version of that transceiver in 1995. In 1996 and 1997, Rockwell took the first step toward low-cost DSL-based modems for digital pair gain and Internet access applications with its ZipWire family of highly integrated single-chip HDSL modem chips. The Bt8960 ZipWire chip provides rate adaptive transport from 160Kbps to 416Kbps at distances up to 14,520 feet, while the Bt8970 provides rates from 160Kbps to 1168Kbps with a reach up to 22,700 feet.
About HDSL2
Products based on the new HDSL2 standard are expected to have broad ------------------------------------------------------------------------------ PRESS (RETURN) FOR MORE, /M FOR HEADLINES, OR ENTER A NEW REQUEST.
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applications. Current two-pair HDSL, which uses 2B1Q code, was developed in 1991 and is used throughout the world by LECs and network service providers for fast, low-cost deployment of T1 (1.544 Mbps) and E1 (2.048 Mbps) services. It currently delivers either 1.544 Mbps or 2.048 Mbps over two twisted pairs at distances up to 12,000 feet. The HDSL2 standard is intended to provide the same performance and service distance over a single line. This is becoming increasingly important as carriers seek to meet accelerating demand for T1/E1 services using a dwindling supply of available copper pairs within the public telephone network. A central component of the OPTIS standard proposal is a spectrally-shaped waveform that does not interfere with existing T1, HDSL or ADSL (Asymmetric Digital Subscriber Line) services, while providing good performance even in worst case environments containing a mixture of other signals. Other recent proposals for HDSL2 have not been able to make this claim. Network service providers will be able to install HDSL2 equipment without being required to upgrade or redesign their cable plant. The HDSL2 alliance was founded by PairGain, ADC Telecommunications Inc. and Level One Communications Inc. ------------------------------------------------------------------------------ PRESS (RETURN) FOR MORE, /M FOR HEADLINES, OR ENTER A NEW REQUEST.
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About Rockwell Semiconductor Systems
Rockwell Semiconductor Systems, based in Newport Beach, is a leading worldwide provider of semiconductor system solutions for personal communications electronics. Rockwell Semiconductor Systems comprises the Personal Computing, Wireless Communications, Network Access, Digital Infotainment and Electronic Commerce divisions. Personal Computing is the leading supplier of facsimile and PC modem chipsets. Wireless Communications provides total system solutions for advanced cordless telephony and global positioning systems receiver engines. Network Access offers a broad line of high-bandwidth communications and networking devices. Digital Infotainment focuses on products for the digital consumer electronics information and entertainment markets. Electronic Commerce is a leading supplier of mission-critical call center systems and personalized electronic commerce applications. Rockwell is a global electronics company with leadership market positions in industrial automation, semiconductor systems and avionics and communications, ------------------------------------------------------------------------------ PRESS (RETURN) FOR MORE, /M FOR HEADLINES, OR ENTER A NEW REQUEST. BUSINESSWIRE STORY 4 PAGE 6 OF 6
with projected fiscal 1997 sales of approximately $8 billion and 44,000 employees. In March, Rockwell announced that it planned to spin off its automotive components business. This transaction is expected to be completed on Sept. 30, 1997.
CONTACT: The Benjamin Group Inc. Carolyn Fromm, 714/245-7500 cfromm@oc.tbgi.com or Rockwell Semiconductor Systems Eileen Algaze 714/221-6849 eileen.algaze@nb.rockwell.com 08:03 EDT SEPTEMBER 16, 1997 ------------------------------------------------------------------------------
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