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Technology Stocks : Intel Corporation (INTC)

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12:35 PM EST

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To: Joey Smith who wrote (32397)	9/22/1997 2:22:00 PM
From: Paul Engel	of 186894

Joey - Re: IBM & COpper Metallization In a different press release, IBM described their new process, CMOS 7S, as having 6 layers of metal, 0.20 micron minimum feature size in addition to the copper metallization process. The 6'th layer of metal (5 layers were used on older processes) and the small feature size will make the chip smaller. The copper will ALLOW this to happen by permitting reduced metal line widths while maintaining the overall trace resistance asociated with metal interconnect - the copper "enables" the reduced metal line geometry. How they call this a CHEAPER process is beyond me - it sure sounds expensive. Perhaps they are "referring" to the cost of the same device designed and produced on their older technology vs. a smaller one redesigned and produced on this new process. Remember - let's believe all of what we SEE and only HALF of what we hear. Paul

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