AMD will ramp down 200mm manufacturing in the second half of 2007, with preparation already underway for the ramp of 300mm wafers on 65nm process technology at Fab 38 by the end of 2007. Through the combination of leading-edge equipment, Automated Precision Manufacturing (APM) and the great people of Dresden, the plant will produce the latest generations of AMD microprocessors, reaching full capacity by the end of 2008. The majority of the investment will go into new equipment in the Fab 38 facility. AMD will also build a new clean room facility on its Dresden campus for Bump and Test requirements, which will support both fabrication facilities. Previously, the clean room facilities for Bump and Test activities were located within Fab 30 and Fab 36. By moving them into a new facility in 2007, AMD has the ability to maximize production space at both Fab 36 and Fab 38, providing increased output and capacity. These three projects have the potential to increase Dresden-based manufacturing to a full capacity of 45,000 300mm wafer starts per month by the end of 2008.
Just for comparison, Fab 30 at the peak produced (produces) 30k 200mm wafers. That is 942M mm^2 (or 942 m^2) of silicon area. 45k of 300mm wafers is 3,179M mm^2 (or 3,179 m^2) of silicon area, which is 3.38x current capacity
BTW, Fab 30 production was good for > 20% of market share. If the marked does not grow, the capacity will be able to supply 68% of the market. Assuming 3 years of growth at 10%, the capacity should be sufficient to supply 50% of the market.
Joe |
