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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 220.09-0.7%9:55 AM EST
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To: j3pflynn who wrote (199273)5/29/2006 7:02:21 PM
From: grimesRead Replies (1) of 275872
 
j3pflynn/cj re "creating the bumps by which the die is connected to the packaging". This happens after the wafers are cut into individual die? Die that are successfully tested are then sent (to Malaysia) for packaging, final test, and speed grading?

Thanks.
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