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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 221.42-0.1%Dec 10 3:59 PM EST
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To: combjelly who wrote (199318)5/29/2006 10:09:32 PM
From: misenRead Replies (1) of 275872
 
Bump refers to the formation of solder bumps on the die that the package eventually is connected to. The IBM C4 process is a fairly typical example. It is done on wafer-level, generally before wafer sort (testing of the die at the wafer-level). After sort, wafers would be sent to the assy site for assy and final test.

Here's a reference on flip-chip technologies:

flipchips.com

misen
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