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Politics : Formerly About Applied Materials
AMAT 297.52-6.6%3:59 PM EST
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To: Big Bucks who wrote (8127)9/23/1997 6:13:00 PM
From: Rob-Chemist   of 70976
 
The technologies used for Cu are very different than those used for other metals such as Al. For example, you cannot use etch to remove excess Cu and there are issues involving the Cu-Si interface (these may involve metal migration, but I am not positive about this). The two primary technological questions are how to deposit the Cu and how to remove it. For removal, CMP appears to be the technology of chioce. For deposition, apparantly both PVD and electrochemical deposition are still candidates. AMAT will likely develop commercially viable solutions to both issues, and be a major player in the market.
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