Formerly About Applied Materials Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Applied Materials

AMAT 297.57

-6.6%

3:59 PM EST

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Kevin Trilli who wrote (8132)	9/23/1997 7:34:00 PM
From: Lucinos	of 70976

Kevin, About 10 Years ago in the industry, the copper lines were electroplated after sputtered and etched a thin copper film (a few tenth of a nano meter) on the wafer surface (called seed layer). This was a very common process for making the thin film devices back at that time. Since Al process is much cheaper than copper process, the copper was only used for a few type of devices. To deal with 0.25um line, to use copper has a lot of advantage. However, I don't think we can use electroplating unless there is a breakthrough in the technology by someone. Thanks. Paul L

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next