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To: TheSpecialist who wrote (3105)	9/24/1997 4:31:00 PM
From: Maxwell	of 25960

TheSpecialist: <<With this in mind, the best outfitting of a fab is a mix of i-line and 248nm.>> The reason that is the case because those fabs are NOT YET in full production of .25u. Majority of their process is still .35u and only a small portion is .25u. Intel is building a fab in Forth Worth, TX and AMD is building 1 in Dresden, Germany. Both are expected to be finished late 1998. Guess how many i-lines they are ordering? NONE! <<You need to bear in mind that the non-critical layers for most applications will remain non-critical for years to come.>> I-line can do at best .30u with phase-shift mask. Any small features below that would require 256nm source. Thus any "non-critical" layers that have smaller feature than .30u would require excimer DUV. As you can see down at .25u process there are only a few layers that require larger than .30. Those layers are Zero layer, Metal 4, Metal 5, and Contacts. When you go to a shrunk version of .25u you can throw those I-line out the window. Someone posted earlier that the Ultratech i-line stepper has a high throughput and thus cheaper cost of ownership (COO). Well that Ultratech stepper is no match for the ASM/300 DUV excimer. The ASM/300 stepper has an incredible (and proven!) throughput of 80 wafers per hour. It is the champ currently. The best photoresist track in the market cannot keep up with this stepper. Maxwell

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