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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 203.76-1.1%Nov 21 9:30 AM EST
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To: Elmer Phud who wrote (207957)8/8/2006 9:49:51 PM
From: Joe SenesacRead Replies (3) of 275872
 
RE: Why would the same amount of particles fall on a wafer with 2.25* the area?

That was my question when I was told it. The answer was that they come from the machine. X number of particles available, 2.25X the die area.

That seems like an oversimplification. I have worked for many years in class 100 areas. Unless we are referring to an enclosed environment that the wafers are processed in that is away from the operators (essentially a barrier isolator), the number of particles available is also dependent upon the cleanliness of the environment aside from the equipment that we are saying is generating the particulate. While I sure that some of the areas we are talking about are class 10 or class 1 (at least by the defunct FS209E specifications), the principles are the same.

So, Elmer, while not knowing as much about semiconductor processing as others on the board, how often are the wafers in environments that are completely separate from the operators, and how often are they exposed to the same environment as the operator?

I would be really curious as to the answer. I would appreciate a non-snide response as someone who is actually trying to understand. All of my experience comes from biotech environments.

Joe

Joe
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