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Politics : Formerly About Applied Materials

AMAT 318.63

-3.0%

Feb 3 3:59 PM EST

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To: Rob-Chemist who wrote (8151)	9/25/1997 11:26:00 AM
From: Big Bucks	of 70976

Rob-Chemist, Thanks for your feedback, all information is useful. FYI-Reactive Ion etching uses a technique of multiple etch steps to enhance specific reactions, for example, Most metals have developed a "native oxide" layer on the order of 50-500Angstroms thick that makes initial etching "uneven" and which can result in "micromasking" which leaves pillars of unetched residual material in columns in the etched away areas. One method of dealing with this is to initially physically and chemically bombard the surface to remove the "native oxide" and expose a uniform surface for the next step of bulk etching. This is very effective at insuring uniform etching of the material being etched without leaving the pillars. With copper, it seems that CMP technology may be a cheaper and faster method than chemical etching and the technology may quickly become the technology of choice. If so, buy stock in companies that sell CMP tools, as the growth will be there over the next 1-3 years. Regards, BB

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