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Politics : Formerly About Applied Materials

AMAT 318.63

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Feb 3 3:59 PM EST

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To: roly who wrote (8185)	9/25/1997 8:13:00 PM
From: Kumar Nathan	of 70976

Roly and Others: I just want to share with you some of the problems that we have in the sub micron technology and the usuage of aluminiums. Currently Aluminium is used as a depositions in wafer processing. Aluminium has two characterisitcs / Problems: 1. Electron migration. That is when the circuit is fired over a long period of time. Aluminium ion has a tendency to move along with current flow causing some damage or faulty connectivity or failure. This caused a lot of reliability problems. You might find a chip working in your site. But after 100 hrs of burn in it suddenly dies due to electron migration effect. and 2. Resistivity: Aluminium has a comparitively high degree of resistivity thus causing heat problems as well the problems relating to sub micron shrinks. Whereas higher conductive materials like cu do not have this problem. To mitigate these problems fab for the past two years or so used "copper doped aluminium alloy" for deposition purposes thus getting the benefits of both. Since IBM came out with cu deposition methodology it is certainly a benefit to the chip makers. This will facilitate faster, smaller chips. On top of it the most important thing is that chip maker can now use cheaper packages for their chips. Currently due to aluminium depositions, lot of heat is generated and packages are designed to conduct and disperse the heat. When we use cu then heat generation will be very less therefore no need for specialized packaging. In my opinion that is the major saving. As I posted earlier, more cleaner and high conductive material is BST. This is not a new technology. This technology is in text books for years. But nobody has come out with the process technology to sandwich the wafer with BST deposition. Regards Kumar

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