Detailed unfolding of my previous post, for some automotive managers, retired Ph.D, and other idiots with zero English comprehension:
Source text:
"<There are no heat sinks> on ASUS 440LX. Some other boards do not have the sink as well."
Explanation: I am speaking about OTHER BOARDS. Not necessary Intel but ASUS, Aopen, etc. Read further: "other boards DO NOT HAVE the [heat] sink." Therefore, there is NO HEAT SINK on these boards and the 440LX chip may become hot.
Consequently, in the following paragraph THEY apparently means MANUFACTURERS OF OTHER BOARDS. They DID WHAT? They left the hot chip naked, so the chip will heat the printed ciruit board.
The source text continues:
"I think they did this on purpose: to equalize the heat dissipated by P-II in order to relieve the motherboard from excessive tension!"
Therefore, free interpretation suggested in
exchange2000.com
is apparently incorrect.
Excessive tension and its implications seems to be more complicated to explain. Vast majority of materials tends to expand when getting hot. If one side of a motherboard is subject to overheating from the CPU (who emits about 40W of heat, like a good soldering iron!), the part of MB around the CPU also gets warm and EXPANDS, together with tiny wires imprinted on the board. If the surrounding chips are COLD, the the board beneath does not expand, and these expanded and non-expanded parts of the same boards produce the aforementioned TENSION which may break these tiny wires, and the computer will stop to work.
The attempted sarcasm here was that if you do not put a heat sink on the top of i440LX chip, it may heat the surrounding plate and compensate for the possible wire tension. If anyone have any more questions,
"Please consult with John Y. Wang on this issue:-))",
or ask pollitely Professor Hugh "nihil". He is very good in interpretations of my obscure writings. Thanks.
With very best to all,
Ali |
