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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 231.83+1.7%Jan 16 9:30 AM EST
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To: dougSF30 who wrote (236950)7/24/2007 11:47:07 AM
From: BUGGI-WORead Replies (4) of 275872
 
@TSMC - 45nm
It could and should be, that AMD will do an MCM package ->
One CPU Die (SOI) + one GPU Die (Bulk@TSMC) = 1 package.

-> the "problem" I have with that is the added feature for
the customer, which is near zero

-> why should a CPU+GPU (2 DIEs, 1 Package) be faster compared
to 1 CPU + 1 GPU Card with the same GPU die?

-> keep in mind the extra logistical tasks and possible errors
-> AMD has a working CPU, anyone places the GPU (working) on
the package and the whole thing is broken -> both broken
-> how do you allocate different CPU speeds with GPU? -> how
many xyz MHz CPUs? with how many zyx GPU Cores?
-> etc. pp.

In the end, the whole theme is way more difficult and brings
many EXTRA headaches which could go wrong and you end with ->
nothing extra for the customer.
Keep in mind, that such solution will ALWAYS be LOW-END, be-
cause if the CPU burns 65W as one example, with how much more
heat could the package work -> a reasonable simple guess
should be additional 60-70W, which would bring the "one package" in
the 120-130W range with 2 DIEs. What do you do, if the GPU
will change -> new layouts?

The whole Fusion concept in this environment doesn't look
very appealing to me.

BUGGI
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