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Technology Stocks : Intel Corporation (INTC)
INTC 48.26-0.7%Feb 5 3:59 PM EST
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To: Gary Kao who wrote (34426)10/9/1997 2:21:00 AM
From: Paul Engel   of 186894
 
Gary - Re: Intel, K & S and Flip Chip Bonding

I discussed this briefly a month or two ago.

Intel's new 0.25 micron process uses C4 - Contorolled Collapse Chip Connection - solder bumps to connect internal circuitry to the physical IC package. This replaces individual wire bonds from aluminum bond pads to the lead fingers or metallization traces on the package.

The chip is attached upside down - with the solder bumps heated with physical (ultrasonic ?) scrubbing melting and making simultaneous solder connections to the package metallization. The operative word here is SIMULTANEOUS. The bonding process takes a few seconds and ALL the connections are made at once.

The older wire bonding operation took quite a while - A Pentium MMX has over 300 bond pads and K & S's fastest wire bonders can do 10 to 15 wire bonds per second - so that takes about 25 to 30 seconds per device.

Intel is using equipment from a Swiss supplier for their flip chip attachment.

However, Intel and K & S have worked closely for over 20 years (Despite K & S's preference for Motorola Microprocessors!) and K & S is developing their own flip chip bonders. Currently, their program is not in a stage for Intel to commit to for prouction machinery. K & S's past performance, however, should indicate that one day they will become a major supplier to Intel for flip chip die bonders.

Paul
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