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Technology Stocks : The New (Profitable) Ramtron

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To: poster1234 who wrote (93)10/26/2007 6:57:44 PM
From: sleupendriewer  Read Replies (1) of 647
 
I think there are two points to this :

The first one is - the time for designing in such a new device like the 4MBit might take slightly longer for the customers than just ejecting the old serial eeprom and using a serial fram - so if they shipped in Q3 the samples and have won right now some of the designs it might take half a year or more for the designs at the customer side to go into production ...
this also influences the rampup of production of the 4Mbit ...

My second point is that I think $19 is for olume production - even if Fujitsu or MRAM is not realy cheaper still quite high. But this might chnage - as Staunton also said - if they paid of the NRE (mask set costs are a little bit higher than for 0.35 um), get a better yield and can reduce testing efforts - this might take some time during the ramp up ...

p.s.: I figured out today - that the die of the FM22L16 has a die area of 17.4mm^2 of which the memory itself uses only half the area - so everyone can calculate now a little bit utilization, etc ...
we might also ask some interesting question - for example : will there be realy the need to go to a smaller node - or is there even in this design still plenty of room to get more out of the die area in the next few years ...
furtheron - if we see that a 130nm process can easily have around 50kgates/mm^2 - we might ask ourself - if around 50% of the area is already used for logic, sense amplifiers and bondpads - why is it so absurd to think that we might not just place an additional mcu with maybe an additional area consumption of 1mm^2 on the die - with only maybe around 5% additional costs ...
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