You said this.
"we might also ask some interesting question - for example : will there be realy the need to go to a smaller node - or is there even in this design still plenty of room to get more out of the die area in the next few years ...
furtheron - if we see that a 130nm process can easily have around 50kgates/mm^2 - we might ask ourself - if around 50% of the area is already used for logic, sense amplifiers and bondpads - why is it so absurd to think that we might not just place an additional mcu with maybe an additional area consumption of 1mm^2 on the die - with only maybe around 5% additional costs .."
Not only do I like the price we'd pay to do this, what are we doing? Are we working hard in a printer, cell phone, camera, radio or what?
I really appreciate your tech information too. It almost wants to put itself together as a process in my brain and I'm certain I'm making the whole situation much harder than it really is. Whatever. I too appreciate your posts. So much nicer than hearing about being a fraud or alias poster. Or whatever else Jim, myself, NO and a few others have been for what would you guys say?? At least 7 years.
This looks good to me because Staunton wouldn't let it out unless he had to and he hates to make things look better than they are. Generally. So you know they could have tons of these little chips already manufactured.
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Do you think about this side of it too. I know smart cards would only be icing on the cake but it's still revenue.
TI enters electronic government ID market
Thursday, September 27 2007
Texas Instruments has unveiled a new contactless smart chip for government-issued IDs. The new chip will have faster read and write times to create and process government electronic IDs more quickly and efficiently. It will also employ an advanced embedded memory technology, called FRAM (Ferroelectric Random Access Memory), designed to improve the speed and reliability of future smart, secure e-passports and government ID documents.
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Dallas, Texas – To address the highly demanding requirements for secure identification documents, such as the electronic passport (e-passport), Texas Instruments Incorporated (TI) has announced that it is applying core capabilities in contactless and power efficient microcontroller technologies along with advanced embedded memory for next generation government identification (ID) products that deliver greater speed, performance, and productivity in issuance and use to customers. (See www.ti.com/govid)
TI's contactless smart integrated circuit (IC) platform will offer an improvement over today's government ID chip technology by enabling fast and accurate production, personalization and processing of government-issued electronic ID documents. Powered by an advanced memory technology, it will feature extremely fast write and read times as well as increased memory capacity and processing performance to accommodate the required security and future data storage requirements.
"The government ID customer has ever-increasing security and memory requirements and the user experience requires fast RF performance,” said Julie England, vice president of Texas Instruments. "TI has focused on solutions that are highly optimized and low power, coupled with extraordinary contactless RF performance. We want to bring those strengths to customers in the ID market.”
State of the Market
The government electronic ID market is gaining momentum as traditional citizen ID documents transition to higher levels of security using embedded smart chips. Contactless technology is a key component of this evolution. In its September 2007 report, "Contactless Government Identification Documents,” ABI Research states that the total market for contactless e-passport transponders is set to grow to nearly $190 million by 2012, while the total market for contactless e-ID documents is expected to reach nearly $1 billion by 2012. With several national ID card programs underway in Europe and Asia, contactless-enabled national ID cards are expected to grow to approximately $750M by 2012.
Bringing Government ID Up to Speed
Most current government ID smart ICs are based on legacy technologies which filled an immediate need for secure electronic ID in first generation government ID applications.
However, some countries, including the U.S., are already looking for significantly faster write speeds to create and process documents more quickly. According to the U.S. Department of State, U.S. e-Passport issuance is expected to grow rapidly from 12.1 million in 2006 to 17 million by the end of 2007. With such volume demands, the need for accuracy and efficiency in production and post-issuance processes is critical. Other advanced market requirements for next generation products include enhanced memory capacity to support future security requirements such as additional biometrics.
These future requirements are stretching the capability of current products and driving the need for new technologies. TI's new smart IC platform is being designed to meet and exceed these requirements.
Designing with Government ID in Mind
"We have combined an evolutionary set of technologies in our portfolio for a fast, scalable smart IC specifically to address the need for efficient issuance and stronger contactless performance in the government ID market,” said Julie England, vice president of Texas Instruments. "As a technology leader in mobile applications, TI understands the importance of power efficiency and scalability to address future needs – while at the same time raising the bar on speed and performance.”
TI's contactless smart platform for the next generation of government ID will employ an advanced embedded memory technology, called FRAM (Ferroelectric Random Access Memory), which considerably improves the speed and reliability of future smart, secure e-passports and government ID documents.
TI's embedded FRAM memory advancement is based upon a joint technology development and licensing agreement with Ramtron International Corporation, a leading supplier of nonvolatile FRAM, formed in 2001. The technology will provide a significant improvement over the non-volatile memory technologies used in current electronic government ID, such as Electrically Erasable Programmable Read-Only Memory (EEPROM) and Flash, offering major advantages in terms of transaction speed, power consumption and enhanced write data reliability. TI's solution helps the government ID customer meet the rigorous demands of the environment in which government ID documents operate.
About Texas Instruments
A technology pioneer in secured contactless applications, Texas Instruments delivers many innovative contactless and secured products to the forefront of electronic ID and payments market. More information can be found at www.ti.com. |
