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To: Ian@SI who wrote (4876)10/10/1997 2:21:00 AM
From: FJB   of 25960
 
Ian,

I think one of James Word's main points was that a single 300mm tool would yield more than twice as many die and therefore if you only wanted to get the same number of parts out of the fab it would require half the lithography tools(assuming the time to expose a wafer is much less than 2x the 200mm tool). On the other hand, if you wanted to be efficient with capital expenditures you could put about as many 300mm tools in a fab of similar clean room space and yield twice as many chips. Or somewhere in between maybe.

Another point to consider is that step and scan is probably a must for 300mm since you can't afford the time required to step across the wafer. Some step and scan tools have field sizes of 1000mmý, so they require many fewer steps. I also read that CMP might be the new bottleneck.
siliconinvestor.com

Some things to consider,

Bob
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