Copper Wiring
(NVLS needs to do some PR - the financial community is either brain dead or ignorant; as you can see GS and MS have NO problem in issuing the bonds which was 10 times oversubscribed by about 150 investors )
Hynix to Invest More in Advanced Chips
By Kim Yoo-chul
Staff Reporter
Hynix Semiconductor will inject more cash into its M11 line in Cheongju, North Chungcheong Province, to expand output of more profitable computer chips.
``We will accelerate the production of 12-inch NAND-type flash chips using 48-nanometer processing technology there as we successfully offered $583.4 million in unsecured fixed-rate convertible bonds due in 2012,'' Hynix spokesman Park Hyun said Tuesday.
The construction of lines producing 300 mm fab will be completed by the end of late March next year. NAND flash chips are used in high-end multimedia gadgets such as digital cameras, car navigation systems and cellphones.
The world's second-largest chipmaker has issued bonds priced at a yield-to-maturity of 4.5 percent with a conversion premium of 42 percent.
Hynix said the result, which was 10 times oversubscribed by about 150 investors, was one of the highest that the company has achieved from its recent bond issues. The notes, which mature on Dec. 11, 2012, will be listed on the Singapore Stock Exchange on Dec. 17.
Credit Suisse, Goldman Sachs, Korea Development Bank, Macquarie Securities, Woori Investment and Securities and Morgan Stanley led the issuance, according to the company.
Hynix to Invest More in Advanced Chips
By Kim Yoo-chul
Staff Reporter
Hynix Semiconductor will inject more cash into its M11 line in Cheongju, North Chungcheong Province, to expand output of more profitable computer chips.
``We will accelerate the production of 12-inch NAND-type flash chips using 48-nanometer processing technology there as we successfully offered $583.4 million in unsecured fixed-rate convertible bonds due in 2012,'' Hynix spokesman Park Hyun said Tuesday.
The construction of lines producing 300 mm fab will be completed by the end of late March next year. NAND flash chips are used in high-end multimedia gadgets such as digital cameras, car navigation systems and cellphones.
The world's second-largest chipmaker has issued bonds priced at a yield-to-maturity of 4.5 percent with a conversion premium of 42 percent.
Hynix said the result, which was 10 times oversubscribed by about 150 investors, was one of the highest that the company has achieved from its recent bond issues. The notes, which mature on Dec. 11, 2012, will be listed on the Singapore Stock Exchange on Dec. 17.
Credit Suisse, Goldman Sachs, Korea Development Bank, Macquarie Securities, Woori Investment and Securities and Morgan Stanley led the issuance, according to the company.
Copper Wiring
The bond issuance came after the Environment Ministry gave the go-ahead for the company to convert its wiring process at the company's plants in Icheon, Gyeonggi Province.
Hynix, which announced earlier this month that it would produce 16-gigabit NAND flash memory chips through the finer 48-nanometer process early this year, has been faced with government objections regarding copper wiring as the process has been regarded as harmful to water resources surrounding the Seoul metropolitan area.
Under the 50-nanometer processing technology, the copper wiring method has been considered the preferred way to maximize production efficiency because of greater electrical conductivity.
``The Cheongju plant is free of environmental concerns and we also have secured a solid foothold to develop advanced 41-nano NAND flash and 40-nano DRAM chips as planned,'' Park said.
Hynix will maintain the portion of NAND flash chips at about 40 percent of the total by the end of the year with greater focus on non-memory chips including image sensor business. |
