SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Strategies & Market Trends : 2026 TeoTwawKi ... 2032 Darkest Interregnum
GLD 414.48+0.7%Jan 9 4:00 PM EST

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: TobagoJack who wrote (29381)2/13/2008 12:03:45 PM
From: oldirtybastard  Read Replies (1) of 219180
 
$46/sqft was just the cost of the building they bought, financed at good terms by state of Colorado, seems like a good deal. Company has $42 million cash, no debt, expected to spend $70million to finish 25MW production facility

Conversion efficiency tested at 11% on Japan sourced Ube Industries polyamide substrate. Tested at 15% on Dow sourced silicone resin substrate, which is not currently available in commercial quantities but ought to change soon. Also contracted by US Airforce to develop 20% efficient tandem stacked cell technology

Silicon efficiency peaks around 12%, CIGS efficiency will improve as plastic substrate technology improves, higher ceiling

Cost projected at $1.55/W at 25MW operating capacity, down to $0.96/W at 100MW

Advantages:

Very little material used vs. silicon, CIGS layer is thinner than human hair

Monolithically integrated modules on flexible plastic substrate rolls, light weight also allows for higher(10x terrestrial) margin specialty applications (aerospace - mgmt roots in lockheed)

Roll to roll production produces rolls that are identical for evey market as well as ability to print multiple modules on each roll to serve multitude of applications

No labor intensive back end assembly of discrete cells into modules, product coming off the line is already at module level

Direct integration into bldg materials and consumer electronic packages
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext