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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 203.76-1.1%Nov 21 9:30 AM EST

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To: wbmw who wrote (248661)3/12/2008 1:57:53 PM
From: pgerassiRead Replies (1) of 275872
 
Wbmw:

I think you better learn to read the documents you link to:

4.1 Package Mechanical Specifications
The processor has two variants, both available in a 478-pin Micro-FCPGA package. Package mechanical dimensions are shown in Figure 4 for the 1-MB fused variant and Figure 6 for the 1-MB variant.


Page 29 of 67.

Kind of says it all.

Page 30 has a 103mm2 die (10mm by 10.3mm). Puts a kibosh on your arguments and Chipguy's passivity coating fantasy. That's a DC 2MB L2 die as shown by:

sandpile.org

Die Size

36 mm² (65 nm SC without L2 Cache)
80.66 mm² (65 nm SC with 1 MB L2 Cache)
111 mm², then 103 mm² (65 nm DC with 2 MB L2 Cache)
143 mm² (65 nm DC with 4 MB L2 Cache)


Pete
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