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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 214.11+3.9%Nov 26 3:59 PM EST

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To: THE WATSONYOUTH who wrote (248763)3/14/2008 8:15:45 PM
From: wbmwRead Replies (1) of 275872
 
Re: Further more.....in the CMOS 400 series, there is NO die dimension specified at all in the package.

The specs aren't for YOU to infer the die size. They are for systems designers to build adequate cooling solutions. In the case of the Celeron 400 series, there is an integrated heat spreader over the die, so - appropriately - you get the mechanical specs for an integrated heat spreader in place of the die length and width.

There are also packaging differences between the Celeron 200 series and Celeron 500 series, the latter of which is a mobile part. I address this one in the last message I posted. These aren't tough concepts to grasp, Watson. All the things you are so rudely demanding can be found in the specs.
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