Bill, the max # of good die per wafer is 140 for the current process, or 370 per wafer with the 0.25 um feature size which will be nearly complete by 3Q '98.
The raw wafers may cost $1000 or less, but add $1000 to that for chemicals, labor, etc. Add $100 per wafer to that for packaging costs and $10 per good chip for packaging costs.
BTW, Paul was pulling your leg in his response which I don't appreciate. I didn't know any of this stuff six months ago. Most of this info comes from previous posts on this thread from Patient Engineer and even some Intelopers. Just search for things like mm, die, size, K6, yield, wafer, etc. Also, read some of the brokerage reports that Albert posts, especially Sutro for yield estimates.
Petz |
