Memory market shows signs of a rebound
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Ingrid Lee, Taipei; Rodney Chan, DIGITIMES [Friday 6 June 2008]
Demand in the memory market is showing signs of a rebound, with IC substrate supplier Kinsus Interconnect Technology and PCB maker Tripod Technology saying June-orders from the flash and DRAM segments, respectively, are increasing.
Kinsus, which boasts the biggest capacity in Taiwan for flash-use system-in-package (SiP) substrates, said orders for the segment are rebounding compared to the weak April and May.
As Kinsus' major clients for SiP substrates include SanDisk and Samsung Electronics, it is an indication that demand for flash is warming up, industry sources commented.
Kinsus sees 44% of its IC substrate shipments to the chip scale package (CSP) segment, and 23% to the SiP segment. The company estimates that the SiP substrate segment will have a double-digit growth for 2008.
Tripod said demand from the DRAM segment is increasing for June although the extent remains not very significant. Tripod sees 24.5% of its revenues from the DRAM segment, with Kingston Technology, Samsung, and Infineon being its chief clients for the segment, according to the sources.
Tripod said the increases in orders may be due to clients' having cleared inventories of their 512Mb legacy products. But it said it is also possible that clients are worried about tight supply in the third quarter and therefore are advancing their orders ahead of the high season.
Tripod said its lead time has now extended to three weeks (it was two weeks), and the time is expected to reach four weeks when the high season comes.
With orders for the second quarter stronger than expected, Tripod now expects an at least 8% sequential growth in revenues for the quarter, the sources said.
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