Competition for Tegal, but I would still go with ULVAC:
Randy Matsuda, senior vice president and general manager of Mattson Technology's Etch Division, said, "We are very pleased to enter into a joint evaluation agreement with this leading memory manufacturer. Mattson already has etch systems employed for volume manufacturing with the customer, and activity to qualify additional applications is underway." Matsuda added, "This agreement further demonstrates our customer's commitment to engage with Mattson for development of future device nodes."
Matsuda continued, "Mattson's etch features a proprietary inductively coupled plasma (ICP) source with wafer bias capability that enables independent control of ion energy and ion density at low processing pressures. These features enable the unique capability for controlling device profiles for very fine geometries. Furthermore, our patented Faraday shield technology ensures that the ion can be generated and controlled at very low energy levels -- a capability that greatly differentiates Mattson's technology from other etchers, allowing it to deliver the lowest damage on the wafer surface. As a result of these technology differentiators, our technology is especially suited for etching of dielectrics at fine geometries, and has demonstrated superior 'on-wafer' results on key applications including spacer etch, hard mask open and pad etch."
semiconductor.net
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